New Electronic Divices: Electronic Components

Electronic Components Biography

Shardul Kazi Senior Vice President and Technology Executive, Systems LSI Group Mr. Kazi is senior vice president and technology executive for the System LSI Group at Toshiba America Electronic Components, Inc. (TAEC). Mr. Kazi is responsible for System LSI Group's two Business Units - Logic LSI Business Unit and Analog and Imaging Business Unit. His responsibility includes management of business units, engineering, finance, supply chain, strategic initiatives, human resources and other support functions for System LSI Group's operations as well as profit and loss performance. As a technology executive, he oversees the entire SLG engineering effort including Standard Products engineering, SoC Design Centers, and the Design Solution Groups. Formerly he was the vice president of the Application Specific Standard Products (ASSP) Business Unit for TAEC and prior to that he was chief operating officer and vice president at ArTile Microsystems, Inc., a TAEC spin-off. Prior to TAEC, he has held several senior management level positions at companies such as Adaptec, SONY Microsystems, MIPS Computer Systems, and AMD.

		Andrew Burt Vice President, Analog and Imaging Business Unit, System LSI Group In this role, Andrew Burt is responsible for all technical marketing and applications support, including profit and loss activities, for the following product lines: CCD linear image sensors, CMOS image sensors, analog and peripheral products, microcontrollers and RF devices. Prior to that, he was director of the Imaging and Communications Business Unit with responsibility for a wide range of standard products based on various wireless and camera technologies. Before that, he held several other Toshiba America Electronic Components, Inc. (TAEC) marketing positions with responsibility for wireless communications products. Before joining TAEC, Mr. Burt served in several marketing and engineering capacities at GEC Plessey Semiconductors in the U.K. and U.S. Prior to that, he was an instrumentation and control engineer at Joint European Torus (JET), a European-funded fusion program. He went to engineering school at Oxford in the U.K. and attended the Chartered Institute of Marketing in London (U.K) for studies in principles of marketing.

		Rakesh Sethi Technology Executive, Head of Technology and Product Planning, System LSI Group Dr. Rakesh Sethi is technology executive, head of technology and product planning for the Logic LSI business unit and the Analog/Imaging business unit in the System LSI Group for Toshiba America Electronic Components, Inc. (TAEC). He is responsible for managing all of SLG's technology offerings, technology expansion, market research, technology relationships and management, and will play an integral role in developing SLG's product roadmap to support both the Analog and Imaging and the Logic LSI business units while focusing on and ensuring SLG's business continuity. He began his career with TAEC in 1998 as senior manager of business development. Mr. Sethi was previously president of CShore Microelectronics Corporation. Prior to that, he served as principal technology manager of EEPROM-based PLD/CPLDs at Cypress Semiconductor. Before that, he served as section head of the Non-Volatile Memory Group at National Semiconductor Corporation. He earned a Ph.D. in electrical engineering from Lehigh University and attained certification from the Executive MBA Institute at Stanford University.